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MicroContamination Research Center Presentation 2007
IUCRC Characterization of Defects
IUCRC_Mechanics of CMP and Post-CMP
IUCRC Post-CMP Adhesion Removal
The Mechanics of CMP and Post-CMO Cleaning
Techniques for Finding and Characterizing Defects and Contaminants
Development of a MEMs Based Micro Gas Analysis System
Particle Adhesion and Removal for Post-CMP Applications
Nano and Microscale Particle Removal
Physical Cleaning of Submicron Trenches, a Modeling Study
The Transport of Contaminants in Thin Film Deposition Processes